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PowerPAK® 8 × 8L BWL

The PowerPAK® 8 x 8 BWL is an 8 mm × 8 mm, 1 mm-profile TO-leadless package engineered for low loss and robust assembly. Its bond-wireless (BWL) construction shortens current paths to cut parasitic inductance and boost current capability, while a fused lead expands the source pad solderable area (~3.35 mm²) to lower current density. Wettable flanks improve solderability and visual inspection, and a low RθJC (~0.36 °C/W) enhances thermal performance. 

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