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PowerPAK® 8 × 8LR

The PowerPAK® 8 × 8LR is a low profile, top-side  cooling package (7.9 mm × 10.2 mm × 1.6 mm) that routes heat directly into a heatsink for higher power density. A Kelvin source pin minimizes parasitics, while an ultra low RθJC (~0.25 °C/W) supports high current. Compared to the D2PAK it’s 36 % the height, saves 52.4 % board space, offers ~2.25× better thermal capability, and ~45 % higher current handling.

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600 V PowerPAK® 8 x 8LR + Gen 4 Superjunction MOSFETs

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