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Run Electronics Cooler With MOSFETs in the PowerPAK® 1212-F
In this video, we explore the new PowerPAK® 1212-F package, which delivers best in class on-resistance, while its source flip technology and central gate design simplify the layout process and enable cooler operation for power circuitry in servers and telecom switches. Compared to the standard PowerPAK 1212, the smaller switching area of the 3.3 mm by 3.3 mm PowerPAK 1212-F reduces the impact of trace noise, while its source flip technology significantly improves thermal performance. The first device in this package — the 30 V SiSD5300DN — offers up to 20 % lower on-resistance compared to previous devices in the same footprint, and an 11 % decrease in thermal resistance.
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