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eSMP Package Evolution

This video shows the package evolution of Vishay's eSMP® Series Packages
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Diodes and Rectifiers

Advantages of SlimSMAW (DO-221AD) Package
With a typical low profile height of 1.0 mm, the SlimSMAW (DO-221AD) package saves significant PCB space compared to standard SMB and SMC packages.
SlimSMA (DO-221AC) Package
With a typical very low profile height, the SlimSMA (DO-221AC) package saves significant PCB space compared to standard SMA, SMB, and SMC packages.
Advantages of SMP (DO-220AA) Package
Increase power density and efficiency, and reduce power losses with low profile SMP package in automotive, commercial, and industrial applications.
SMF (DO-219AB) Package
Increase power density and reduce overall costs with the low profile (1.0 mm) and compact SMF package, in automotive, commercial, industrial, and telecom applications, compared to SMA, SMB, and SMC packages.
Advantages of SMPD (TO-263AC) Package
Reduce power losses and improve efficiency in automotive, commercial, and industrial applications with the SMPD package; low profile of 1.7 mm and footprint compatible with D2PAK (TO-263AB) package.