M PRODUCT INFORMATION

High Reliability Thick Film Resistor, Surface-Mount Chip
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FEATURES

High purity alumina substrate for high power dissipation (2 W max.)
Wraparound terminations featuring a thin film adhesion layer covered with a leach resistant nickel barrier layer for +150 °C operating conditions
High speed laser trimming for high volume requirements


Showing 1 to 14 of 14 entries
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Datasheet
High Reliability Thick Film Resistor, Surface-Mount Chip
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General Information
Vishay Dale Thin Film Land Patterns
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Lead Free
Resistor and Plasma Display Lead-Free Product Family-2011
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Packaging Information
Waffle Pack Packaging
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Packaging Information
8 mm, 12 mm, 16 mm, and 24 mm Embossed Conductive Tape Conforming to EIA-481
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Product Literature
Vishay Dale Thin Film Chip Overview: Resistive Solutions for a Wide Range of Industries
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Product Literature
Resistors 101 - Instructional Guide
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Product Literature
Quick Chip Program for Vishay Dale Thin Film Resistors
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Product Literature
Precision Thin Film Technology
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Technical Notes
Vishay Thin Film Lead Free Wraparound Process
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Technical Notes
Pulse Load Handling for Fixed Linear Resistors
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Technical Notes
线性固定电阻器的脉冲载荷处理 - Pulse Load Handling for Fixed Linear Resistors
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Technical Notes
Pulse Load Handling for Fixed Linear Resistors
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Technical Notes
Drift Calculation for Thin Film Resistors
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